WM2637

Production Data

WOLFSON MICROELECTRONICS LTD

PD Rev 1.0 July 99

11

PACKAGE DIMENSIONS

DM009.B

D: 8 PIN SOIC 3.9mm Wide Body

Symbols

Dimensions

(mm)

Dimensions

(Inches)

MIN

MAX

MIN

MAX

A

1.35

1.75

0.0532

0.0688

0.10

0.25

0.0040

0.0098

B

0.33

0.51

0.0130

0.0200

C

0.19

0.25

0.0075

0.0098

D

4.80

5.00

0.1890

0.1968

e

1.27 BSC

0.050 BSC

E

3.80

4.00

0.1497

0.1574

h

0.25

0.50

0.0099

0.0196

H

5.80

6.20

0.2284

0.2440

L

0.40

1.27

0.0160

0.0500

α

α

0

o

8

o

0

o

8

o

REF:

JEDEC.95, MS-012

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).

D. MEETS JEDEC.95 MS-012, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

C

α

L

A

A1

SEATING PLANE

-C-

0.10 (0.004)

4

1

D

5

8

E

H

B

e