WM8731

Advanced Information

WOLFSON MICROELECTRONICS LTD

AI Rev 2.0 February 2001

3

CLOCKOUT ............................................................................................................................................ 31

DIGITAL AUDIO INTERFACES .............................................................................................................. 32

MASTER AND SLAVE MODE OPERATION .......................................................................................... 35

AUDIO DATA SAMPLING RATES

36

NORMAL MODE SAMPLE RATES ........................................................................................................37

128/192fs NORMAL MODE .................................................................................................................... 39

512/768fs NORMAL MODE .................................................................................................................... 39

USB MODE SAMPLE RATES................................................................................................................. 40

ACTIVATING DSP AND DIGITAL AUDIO INTERFACE

41

SOFTWARE CONTROL INTERFACE

41

SELECTION OF SERIAL CONTROL MODE .......................................................................................... 41

3-WIRE (SPI COMPATIBLE) SERIAL CONTROL MODE ...................................................................... 42

2-WIRE SERIAL CONTROL MODE........................................................................................................ 42

POWER DOWN MODES

43

REGISTER MAP

45

DIGITAL FILTER CHARACTERISTICS............................................................... 50

TERMINOLOGY

50

DAC FILTER RESPONSES ................................................................................. 51

ADC FILTER RESPONSES ................................................................................. 52

ADC HIGH PASS FILTER

53

DIGITAL DE-EMPHASIS CHARACTERISTICS................................................... 54

RECOMMENDED EXTERNAL COMPONENTS .................................................. 55

PACKAGE DIMENSIONS .................................................................................... 56