X28HT512

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LIMITED WARRANTY

Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes

no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described

devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness tor any purpose. Xicor, Inc. reserves the right to

discontinue production and change specifications and prices at any time and without notice.

Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents,

licenses are implied.

US. PATENTS

Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481;

4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976.

Foreign patents and additional patents pending.

LIFE RELATED POLICY

In situations where semiconductor component failure may endanger life, system designers using this product should design the system with

appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence.

Xicor’s products are not authorized for use as critical components in life support devices or systems.

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life,

and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected

to result in a significant injury to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure

of the life support device or system, or to affect its satety or effectiveness.

ORDERING INFORMATION

Device

Access Time

–25 = 250ns

–20 = 200ns

Temperature Range

Blank = 25

°C to +175°C

Package

D = 32-Lead CerDip

F = 32-Lead Flat Pack

K = 36-Lead Pin Grid Array

R = 32-Lead Ceramic SOIC

X28HT512

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X

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