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SS8053G

9/27/2006 Rev.1.01

Input Voltage………………………………….…………7V

Power Dissipation Internally Limited

(Note 2)

Maximum Junction Temperature.…………………150°C

Storage Temperature Range.……..-65°C

<T

Reflow Temperature (soldering, 10sec)…..…....260°C

Thermal Resistance Junction to Ambient.……141°C/W

Thermal Resistance Junction to Case…………..20.1°C/W

ESD Rating (Human Body Model)……….………….2kV

OPERATING CONDITIONS

(Note 1)

Input Voltage………………………………..…2.2V ~5.5V

Temperature Range………….………-40°C

<T

ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

CONDITION

MIN

TYP

MAX

UNIT

Supply Voltage

2.2

---

5.5

V

Output Voltage

-2

2

%

Line Regulation

---

0.2

2

%

Load Regulation

---

0.8

2

%

Quiescent Current

---

1.7

2.5

mA

Ripple Rejection

---

55

---

dB

Dropout Voltage

---

0.5

0.65

V

Short Circuit Current

---

0.8

---

A

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Con-

ditions are conditions under which the device functions but the specifications might not be guaranteed. For

guaranteed specifications and test conditions see the Electrical Characteristics.

Note2: The maximum power dissipation is a function of the maximum junction temperature, T

resistance,

Q

and

the chip will go into thermal shutdown.

Note3: Low duty pulse techniques are used during test to maintain

the junction temperature as close to ambient as possible.

Note4: The type of output capacitor should be tantalum or aluminum.

Definitions

Dropout Voltage

The input/output

voltage differential at which the regu-

lator output no longer maintains regulation against fur-

ther reductions in input voltage. Measured when the

output drops 2% below its nominal value, dropout volt-

age is affected by junction temperature, load current

and minimum input supply requirements.

Line Regulation

The change in output voltage for a change in input

voltage. The measurement is made under conditions

of low dissipation or by using pulse techniques such

that

the average chip temperature is not significantly

affected.

Load Regulation

The change in output voltage for a change in load

current at constant chip temperature. The measure-

ment is made under conditions of low dissipation or by

using pulse techniques such that

the average chip

temperature is not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the

regulator will

still operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip

and is not delivered to the load.