8

X25F064/032/016/008

*COMMENT

Stresses above those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device.

This is a stress rating only and the functional operation

of the device at these or any other conditions above

those listed in the operational sections of this specification

is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

ABSOLUTE MAXIMUM RATINGS*

Temperature Under Bias .................. –65

°C to +135°C

Storage Temperature ....................... –65

°C to +150°C

D.C. Output Current ............................................. 5mA

Lead Temperature

(Soldering, 10 Seconds) ............................. 300

°C

D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.)

Limits

Symbol

Parameter

Min.

Max.

Units

Test Conditions

5

mA

SO = Open,

1

µA

10

µA

Input Leakage Current

10

Output Leakage Current

–1

10

Input LOW Voltage

V

Input HIGH Voltage

V

Output LOW Voltage

0.4

V

Output HIGH Voltage

V

Output LOW Voltage

0.4

V

Output HIGH Voltage

V

6685 PGM T08.4

RECOMMENDED OPERATING CONDITIONS

Temp

Min.

Max.

Commercial

0

°C

+70

°C

Extended

–20

°C

+85

°C

Industrial

–40

°C

+85

°C

6685 PGM T06.2

Supply Voltage

Limits

X25F064/032/016/008

1.8V to 3.6V

X25F064/032/016/008–5

4.5V to 5.5V

6685 PGM T07.3

POWER-UP TIMING

Symbol

Parameter

Min.

Max.

Units

Power-up to Read Operation

1

ms

Power-up to Write Operation

5

ms

6685 PGM T09

Notes:

(2) This parameter is periodically sampled and not 100% tested.

are periodically sampled and not 100% tested.

Symbol

Test

Max.

Units

Conditions

Output Capacitance (SO)

8

pF

Input Capacitance (SCK, SI,

CS, WP, HOLD)6

pF

6685 PGM T10.1