74LVC3G34_7

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 07 — 9 May 2008

2 of 16

NXP Semiconductors

74LVC3G34

Triple buffer

3.

Ordering information

4.

Marking

5.

Functional diagram

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

74LVC3G34DP

−40 °C to +125 °C

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

SOT505-2

74LVC3G34DC

−40 °C to +125 °C

VSSOP8

plastic very thin shrink small outline package; 8 leads;

body width 2.3 mm

SOT765-1

74LVC3G34GT

−40 °C to +125 °C

XSON8

plastic extremely thin small outline package; no leads;

8 terminals; body 1

× 1.95 × 0.5 mm

SOT833-1

74LVC3G34GD

−40 °C to +125 °C

XSON8U plastic extremely thin small outline package; no leads;

8 terminals; UTLP based; body 3

× 2 × 0.5 mm

SOT996-2

74LVC3G34GM

−40 °C to +125 °C

XQFN8U

plastic extremely thin quad flat package; no leads;

8 terminals; UTLP based; body 1.6

× 1.6 × 0.5 mm

SOT902-1

Table 2.

Marking codes

Type number

Marking code

74LVC3G34DP

V34

74LVC3G34DC

Y34

74LVC3G34GT

Y34

74LVC3G34GD

Y34

74LVC3G34GM

Y34

Fig 1.

Logic symbol

Fig 2.

IEC logic symbol

Fig 3.

Logic diagram (one gate)

001aah842

1A

1Y

3Y

3A

2A

2Y

1

1

001aah843

1

001aac536

Y

A