IP4778CZ38_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 12 February 2009

20 of 26

NXP Semiconductors

IP4778CZ38

HDMI ESD protection, DDC buffering and hot plug control

12. Package outline

Fig 17. Package outline SOT510-1 (TSSOP38)

UNIT

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

8

0

o

o

0.08

DIMENSIONS (mm are the original dimensions).

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

SOT510-1

03-02-18

05-11-02

θ

A

D

detail X

E

Z

e

c

L

X

(A )

3

0.25

1

19

38

20

y

b

H

0.95

0.85

0.27

0.17

0.20

0.09

9.8

9.6

4.5

4.3

0.5

1

0.2

6.4

0.49

0.21

0.08

0.7

0.5

p

E

A

TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm;

lead pitch 0.5 mm

SOT510-1

A

max.

1.1

0

2.5

5 mm

scale

pin 1 index

MO-153