PCA9533_3

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 03 — 27 April 2009

21 of 24

NXP Semiconductors

PCA9533

For further information on temperature profiles, refer to Application Note

AN10365

“Surface mount reflow soldering description”.

16. Abbreviations

MSL: Moisture Sensitivity Level

Fig 24. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 17.

Abbreviations

Acronym

Description

ACPI

Advanced Configuration and Power Interface

CDM

Charged Device Model

DSP

Digital Signal Processor

DUT

Device Under Test

ESD

ElectroStatic Discharge

GPIO

General Purpose Input/Output

HBM

Human Body Model

Inter-Integrated Circuit bus

LED

Light Emitting Diode

MCU

MicroController Unit

MM

Machine Model

MPU

MicroProcessor Unit

POR

Power-On Reset

RC

Resistor-Capacitor network

SMBus

System Management Bus