PCF2120_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 5 February 2008

2 of 14

NXP Semiconductors

PCF2120

Quartz oscillator

5.

Ordering information

[1]

Packing method: sawn wafer on Film Frame Carrier (FFC).

6.

Block diagram

7.

Pinning information

7.1 Pinning

Table 2.

Ordering information

Type

number

Package

Name

Description

Version

PCF2120TK

HVSON10

plastic thermal enhanced very thin small outline

package; no leads; 10 terminals; body 3

× 3 × 0.85 mm

SOT650-1

PCF2120U[1] -

wire bond die; 7 bonding pads; 0.57

× 1.1 × 0.2 mm

PCF2120U

Pin numbers shown for HSVON10 package.

Fig 1.

Block diagram

001aaf631

TEST

OSCO

OSCI

CLKOUT

n.c.

CLKOE

10

3

2

5

79

8

1, 4, 6

CL(itg)

PCF2120

Fig 2.

Pin configuration HVSON10

package

Fig 3.

Pad configuration wire bond die

001aaf628

PCF2120TK

n.c.

n.c.

TEST

OSCO

CLKOUT

OSCI

n.c.

CLKOE

Transparent top view

5

6

4

7

3

8

2

9

1

10

terminal 1

index area

001aah559

2

OSCO

1

OSCI

7

PCF2120U

CLKOE

5

CLKOUT

4

TEST

3