PCF8563_6

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 06 — 21 February 2008

23 of 32

NXP Semiconductors

PCF8563

Real-time clock/calendar

13. Package outline

Fig 23. Package outline SOT97-1 (DIP8)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT97-1

99-12-27

03-02-13

UNIT

A

max.

12

(1)

(1)

(1)

cD

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

1.73

1.14

0.53

0.38

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05

0.254

2.54

7.62

8.25

7.80

10.0

8.3

1.15

4.2

0.51

3.2

inches

0.068

0.045

0.021

0.015

0.014

0.009

1.07

0.89

0.042

0.035

0.39

0.36

0.26

0.24

0.14

0.12

0.01

0.1

0.3

0.32

0.31

0.39

0.33

0.045

0.17

0.02

0.13

050G01

MO-001

SC-504-8

c

(e )

1

A

L

e

D

Z

8

1

5

4

b

E

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1