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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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PCF8564ACX9/B/1 데이터시트(PDF) 40 Page - NXP Semiconductors |
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PCF8564ACX9/B/1 데이터시트(HTML) 40 Page - NXP Semiconductors |
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40 / 44 page  PCF8564A_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 1 — 8 October 2009 40 of 44 NXP Semiconductors PCF8564A Real time clock and calendar Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. The surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill removed. When a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the substrate. Place and align the new chip while viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 “Surface mount reflow soldering description”. 19.3.4 Cleaning Cleaning can be done after reflow soldering. |
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