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1206SFH050F/32-2 데이터시트(PDF) 6 Page - Tyco Electronics

부품명 1206SFH050F/32-2
상세설명  Slow-Blow Chip Fuses
PDF  8 Pages
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제조업체  MACOM [Tyco Electronics]
홈페이지  http://www.macom.com
Logo MACOM - Tyco Electronics

1206SFH050F/32-2 데이터시트(HTML) 6 Page - Tyco Electronics

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13
RoHS Compliant, ELV Compliant
HF Halogen Free
Range
Performance
Testing Method
Min.
Max.
MVR
ASTM D1238
3.60
4.40
Vicat softening temperature
ASTM D1525
97.8
-
Elasticity at break
ASTM D638
50.0
-
Tape and Reel Material Characteristics for Slow-Blow Chip Fuses
Table FS7
Tolerance X ± 1mm; 0.X ± 0.5mm; 0.XX ± 0.2mm
Tape and Reel Specifications for Slow-Blow Chip Fuses
Table FS8
Dimension in inches (mm)
Mark
0603 (1608)
1206 (3216)
E1
0.069±0.004
(1.75±0.10)
0.069±0.004
(1.75±0.10)
F
0.138±0.002
(3.50±0.05)
0.138±0.002
(3.50±0.05)
W
0.318±0.004
(8.00±0.10)
0.318±0.004
(8.00±0.10)
P1
0.157±0.004
(4.00±0.10)
0.157±0.004
(4.00±0.10)
P0
0.157±0.004
(4.00±0.10)
0.157±0.004
(4.00±0.10)
P2
0.079±0.002
(2.00±0.05)
0.079±0.002
(2.00±0.05)
D0
0.059±0.004
(1.50+0.10/-0.00)
0.059±0.004
(1.50+0.10/-0.00)
D1
--
0.039 max
(1.00 max)
t
0.009±0.001
(0.23±0.02)
0.009±0.001
(0.23±0.02)
A0
0.036±0.004
(0.92±0.10)
0.071±0.004
(1.80±0.10)
B0
0.071±0.004
(1.80±0.10)
0.138±0.004
(3.50±0.10)
K0
0.033±0.004
(0.85±0.10)
0.050±0.004
(1.27±0.10)
Taped Component Dimensions for Slow-Blow Chip Fuses
Figure FS7
P
0
E
1
F
W
P
2
D
0
D
1
A
0
P
1
B
0
K
0
t
Recommended conditions for hand soldering:
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.
Maximum temperature of soldering iron tip/soldering time: 350°C /9s or 400°C / 8s.
Time (s)
Soldering
10s Max.
Natural
Cooling
260
230
150-180
Preheat 60 - 120s Min.
40s Max.
Recommended Soldering Temperature Profile for Slow-Blow Chip Fuses
Figure FS6



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