2004 Aug 13

5

NXP Semiconductors

Product data sheet

NPN resistor-equipped transistors;

R1 = 22 k

Ω, R2 = open

PDTC124T series

THERMAL CHARACTERISTICS

Notes

1.

Refer to standard mounting conditions.

2.

Reflow soldering is the only recommended soldering method.

3.

Refer to SOT883 standard mounting conditions; FR4 with 60

μm copper strip line.

CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to ambient

in free air

SOT54

note 1

250

K/W

SOT23

note 1

500

K/W

SOT346

note 1

500

K/W

SOT323

note 1

625

K/W

SOT490

notes 1 and 2

500

K/W

SOT883

notes 2 and 3

500

K/W

SOT416

note 1

833

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

collector-base cut-off current

−

−

100

nA

collector-emitter cut-off current

−

−

1

μA

−

−

50

μA

emitter-base cut-off current

−

−

100

nA

DC current gain

100

−

−

collector-emitter saturation voltage

−

−

150

mV

R1

input resistor

15.4

22

28.6

k

Ω

collector capacitance

f = 1 MHz

−

−

2.5

pF