MP3V5004G

Sensors

4

Freescale Semiconductor

Pressure

On-chip Temperature Compensation and Calibration

The performance over temperature is achieved by

integrating the shear-stress strain gauge, temperature

compensation, calibration and signal conditioning circuitry

onto a single monolithic chip.

chip carrier (Case 482A). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the silicon diaphragm.

The MP3V5004G series sensor operating characteristics

are based on the use of dry air as pressure media. Media,

other than dry air, may have adverse effects on sensor

performance and long-term reliability. Internal reliability and

qualification test for dry air, and other media, are available

from the factory. Contact the factory for information regarding

media tolerance in your application.

interfacing the output of the MP3V5004G to the A/D input of

the microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

pressure input. Typical, minimum and maximum output

curves are shown for operation over a temperature range of

10

The output will saturate outside of the specified pressure

range.

Figure 2. Cross Sectional Diagram SSOP (not to scale)

Figure 3. Recommended Power Supply Decoupling and

Output Filtering.

(For additional output filtering, please refer to Application

Note AN1646.)

(See Note 5 in Operating Characteristics table)

+3 V

1.0 μF

0.01 μF

470 pF

GND

IPS

OUTPUT

Fluorosilicone

Gel Die Coat

Differential Sensing

Element

Stainless

Steel Cap

P1

P2

Die Bond

Die

Thermoplas-

tic

Lead

Frame

Wire

Bond

3.0

1.0

2.0

0.6

Max

Min

Typical

2 kPa

4 kPa

TRANSFER FUNCTION:

TEMP = 10 to 60°C