LTC4360-1/LTC4360-2

11

436012f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

SC8 Package

8-Lead Plastic SC70

(Reference LTC DWG # 05-08-1639 Rev Ø)

1.15 – 1.35

(NOTE 4)

1.80 – 2.40

0.15 – 0.27

8 PLCS (NOTE 3)

SC8 SC70 0905 REV Ø

1.80 – 2.20

(NOTE 4)

0.50 BSC

PIN 1

PIN 8

0.80 – 1.00

1.00 MAX

0.00 – 0.10

REF

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL,

BUT MUST BE LOCATED WITHIN THE INDEX AREA

7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70 AND JEDEC MO-203 VARIATION BA

2.8 BSC

0.30

MAX

0.50

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.8 REF

1.00 REF

INDEX AREA

(NOTE 6)

0.10 – 0.18

(NOTE 3)

0.26 – 0.46

GAUGE PLANE

0.15 BSC

0.10 – 0.40