Chip Information

PROCESS: BiCMOS

Step-Down Converters

______________________________________________________________________________________

11

Package Information

For the latest package outline information and land patterns, go

to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in

the package code indicates RoHS status only. Package draw-

ings may show a different suffix character, but the drawing per-

tains to the package regardless of RoHS status.

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

10 TDFN

T1033-1

21-0137

90-0003