MAX14548E datasheet(2/17 Pages) MAXIM

2 / 17 page

100Mbps, 16-Channel LLTs

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.)

VCC, VL, EN, PF.......................................................-0.3V to +4V

I/O VCC_ ................................................... -0.3V to (VCC + 0.3V)

I/O VL_ ......................................................... -0.3V to (VL + 0.3V)

Short-Circuit Duration I/O VL_,

I/O VCC_ to GND....................................................Continuous

Continuous Power Dissipation (TA = +70NC)

40-Bump WLP (derate 17.2mW/NC above +70NC) ....1379mW

Junction-to-Ambient Thermal Resistance (BJA)

(Note 1) ........................................................................58NC/W

Operating Temperature Range.......................... -40NC to +85NC

Storage Temperature Range............................ -65NC to +150NC

Junction Temperature .....................................................+150NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(VCC = +1.7V to +3.6V, VL = +1.1V to +3.6V, VCC > VL, EN = VL, CVCC = 1FF, CVL = 1FF, TA = -40NC to +85NC, unless otherwise

noted. Typical values are at VCC = +2.8V, VL = +1.8V and TA = +25NC.) (Notes 2, 3)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLIES

VL Supply Range

1.1

3.6

VCC Supply Range

VCC

1.7

3.6

Supply Current from VCC

IQVCC

I/O VCC_ = VCC, I/O VL_ = VL

Supply Current from VL

IQVL

I/O VCC_ = VCC, I/O VL_ = VL

VCC Shutdown Supply

Current

ISHDN-VCC

TA = +25NC, EN = GND, unconnected

I/O pins

0.1

VL Shutdown Mode Supply

Current

ISHDN-VL

TA = +25NC, EN = GND, unconnected

I/O pins

0.1

TA = +25NC, EN = VL, VCC = GND,

unconnected I/O pins

0.1

Dynamic Supply Current

One I/O switching at

25MHz; all other I/O

connected to VCC or

VL; CLOAD = 0pF

MAX14548E

2.9

MAX14548AE

2.6

I/O VCC_, I/O VL_ Three-State

Leakage Current

ILEAK

TA = +25NC, EN = GND

0.1

EN, PF Input Leakage Current

ILEAK_EN_PF

TA = +25NC

VL Shutdown Threshold

VTH_VL

0.3

VL - VCC Shutdown Threshold

High

VTH_H

VCC rising (VL = 3.6V) (Note 4)

0.05

0.3

0.65

VL - VCC Shutdown Threshold

Low

VTH_L

VCC falling (VL = 3.6V) (Note 4)

0.2

0.52

0.85

I/O VL_ Pullup Current

IVL_PU_

I/O VL_ = GND, I/O VCC_ = GND

125

I/O VCC_ Pullup Current

IVCC_PU_

I/O VCC_ = GND, I/O VL_ = GND

I/O VL_ to I/O VCC_ DC

Resistance

RIOVL_IOVCC

(Note 5)

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