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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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DVA12XP080 데이터시트(PDF) 11 Page - Microchip Technology |
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DVA12XP080 데이터시트(HTML) 11 Page - Microchip Technology |
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11 / 18 page  © 2006 Microchip Technology Inc. DS51140M-page 11 Processor Module and Device Adapter Specification 6.2 TQFP/PLCC Device Footprints TQFP/PLCC device adapter footprints shown will accept board stackers like Samtec series DWM 0.050 Pitch Stackers. These stackers can be soldered in place during development/emulation and eliminate the need for any other sockets. FIGURE 6-2: DVA DRAWING – SINGLE-ROW TQFP/PLCC FIGURE 6-3: DVA DRAWING – DOUBLE-ROW TQFP/PLCC B A w, x, y, z = TQFP Pin 1 location w’, x’, y’, z’ = PLCC Pin 1 location See Table 6-2 for A & B dimensions and Pin 1 location. C C 0.050 0.028 DIA PLATED-THRU HOLES UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Drawing of device is 80/84-pin TQFP/PLCC. Device C 44-Pin (TQFP) 0.800 64/68-Pin (TQFP/PLCC) 0.960 80/84-Pin (TQFP/PLCC) 1.160 w’ w x x’ y y’ z z’ B w’ A w w, x, y, z = TQFP Pin 1 location w’, x’, y’, z’ = PLCC Pin 1 location See Table 6-2 for A & B dimensions and Pin 1 location. 0.050 0.028 DIA PLATED-THRU HOLES UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. x x’ y y’ z z’ 1.160 1.160 0.960 0.960 |
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