IR3521 datasheet(41/45 Pages) IRF

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IR3521

Page 41

V3.03

PCB METAL AND COMPONENT PLACEMENT

 Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should

be ≥ 0.2mm to prevent shorting.

 Lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm

inboard extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard

extension will accommodate any part misalignment and ensure a fillet.

 Center pad land length and width should be equal to maximum part pad length and width. However, the

minimum metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper (≥ 0.1mm for 1 oz. Copper and ≥

0.23mm for 3 oz. Copper)

 Four 0.30mm diameter vias shall be placed in the center of the pad land and connected to ground to

minimize the noise effect on the IC.

 No pcb traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing so

can cause the IC to rise up from the pcb resulting in poor solder joints to the IC leads.

IR3521 데이터시트(PDF) 41 Page - International Rectifier