Rev 9.0

IR3840WMPbF

32

Solder Resist

It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder

resist should be pulled away from the metal lead lands by a minimum of 0.025mm to ensure

NSMD pads.

The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder

resist onto the copper of 0.05mm to accommodate solder resist mis-alignment.

Ensure that the solder resist in-between the lead lands and the pad land is

≥ 0.15mm due to

the high aspect ratio of the solder resist strip separating the lead lands from the pad land.