LTC3829



3829f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

package DescripTion

FE Package

38-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1772 Rev A)

Exposed Pad Variation AA

4.75

(.187)

REF

FE38 (AA) TSSOP 0608 REV A

0.09 – 0.20

(.0035 – .0079)

0 – 8

0.25

REF

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

1

19

20

REF

9.60 – 9.80*

(.378 – .386)

38

1.20

(.047)

MAX

0.05 – 0.15

(.002 – .006)

0.50

(.0196)

BSC

0.17 – 0.27

(.0067 – .0106)

TYP

RECOMMENDED SOLDER PAD LAYOUT

0.315 ±0.05

0.50 BSC

4.50 REF

6.60 ±0.10

1.05 ±0.10

4.75 REF

2.74 REF

2.74

(.108)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

6.40

(.252)

BSC