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SN74LVC2GU04DBVT 데이터시트(PDF) 1 Page - Texas Instruments |
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SN74LVC2GU04DBVT 데이터시트(HTML) 1 Page - Texas Instruments |
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1 / 14 page ![]() www.ti.com FEATURES Seemechanicaldrawingsfordimensions. DBVPACKAGE (TOP VIEW) DCKPACKAGE (TOP VIEW) 2 GND V CC 5 3 4 2A 2Y 6 1 1A 1Y 3 4 2A 2 GND 2Y 5 1 1A V CC 6 1Y YZP PACKAGE (BOTTOMVIEW) 2 GND V CC 1 5 1A 2A 4 3 2Y 6 1Y DESCRIPTION/ORDERING INFORMATION SN74LVC2GU04 DUAL INVERTER GATE SCES197M – APRIL 1999 – REVISED FEBRUARY 2007 • Available in the Texas Instruments • Typical V OHV (Output VOH Undershoot) >2 V at NanoFree™ Package V CC = 3.3 V, TA = 25°C • Supports 5-V V CC Operation • Unbuffered Outputs • Inputs Accept Voltages to 5.5 V • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • Max t pd of 3.7 ns at 3.3 V • ESD Protection Exceeds JESD 22 • Low Power Consumption, 10-µA Max I CC – 2000-V Human-Body Model (A114-A) • ±24-mA Output Drive at 3.3 V – 200-V Machine Model (A115-A) • Typical V OLP (Output Ground Bounce) <0.8 V at V CC = 3.3 V, TA = 25°C – 1000-V Charged-Device Model (C101) This dual inverter is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2GU04 contains two inverters with unbuffered outputs and performs the Boolean function Y = A. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Reel of 3000 SN74LVC2GU04YZPR _ _ _CD_ (Pb-free) Reel of 3000 SN74LVC2GU04DBVR –40°C to 85°C SOT (SOT-23) – DBV CU4_ Reel of 250 SN74LVC2GU04DBVT SN74LVC2GU04DCKR SOT (SC-70) – DCK Reel of 3000 CD_ SN74LVC2GU04DCKT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 1999–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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