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ADT7462ACPZ-R7 데이터시트(PDF) 2 Page - ON Semiconductor

부품명 ADT7462ACPZ-R7
상세설명  Flexible Temperature, Voltage Monitor, and System Fan Controller
PDF  81 Pages
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제조업체  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

ADT7462ACPZ-R7 데이터시트(HTML) 2 Page - ON Semiconductor

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ADT7462
http://onsemi.com
2
Figure 1. Functional Block Diagram
SMBus
ADDRESS
SELECTION
SERIAL BUS
INTERFACE
VID
REGISTER
PWM REGISTERS
ADDRESS POINTER
REGISTER
PWM
CONFIGURATION
REGISTERS
INTERRUPT
MASKING
RESET
CIRCUIT
GPIO STATUS AND
CONFIGURATION
REGISTERS
SCSI STATUS
PERFORMANCE
MONITORING
THERMAL
PROTECTION
INPUT SIGNAL
CONDITIONING
AND ANALOG
MULTIPLEXER
BAND GAP
TEMPERATURE
SENSOR
VID0 TO VID6
PWM1 TO PWM4
TACH1 TO TACH8
VR_HOT2
VR_HOT1
THERM2
THERMAL DIODE INPUTS
VOLTAGE INPUTS
ADT7462
VALUE AND LIMIT
REGISTERS
LIMIT
COMPARATORS
INTERRUPT
STATUS
REGISTERS
AUTOMATIC
FAN SPEED
CONTROL
ACOUSTIC
ENHANCEMENT
CONTROL
DYNAMIC TMIN
CONTROL
13−BIT
ADC
BAND GAP
REFERENCE
GPIO1 TO GPIO8
RESET
CI
GND
ADD
SCL SDA
ALERT
FAN SPEED
COUNTER
FAN2MAX
THERM1
SCSI_TERM1 AND
SCSI_TERM2
ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
Supply Voltage
6.5
V
Voltage on +12V Pin
20
V
Voltage on VBATT Pin
4.0
V
Voltage on Any Other Input or Output Pin
−0.3 to +6.5
V
Input Current at Any Pin
±5
mA
Package Input Current
±20
mA
Maximum Junction Temperature (TJMAX)
150
°C
Operating Temperature Range
−40 to +125
°C
Storage Temperature Range
−65 to +150
°C
Lead Temperature, Soldering
Lead Temperature (Soldering, 10 sec)
IR Reflow Peak Temperature
300
260
°C
ESD Rating
1500
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
THERMAL CHARACTERISTICS
Package Type
qJA
qJC
Unit
32−Lead LFCSP_VQ
32.5
32.71
°C/W
1. qJA is specified for the worst−case conditions, that is, a device soldered in a circuit board for surface−mount packages.



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