ADT7481

http://onsemi.com

2

Figure 1. Functional Block Diagram

11−BIT A−TO−D

CONVERTER

RUN/STANDBY

BUSY

REMOTE 1 AND 2 TEMP

OFFSET REGISTERS

STATUS REGISTERS

INTERRUPT

MASKING

CONFIGURATION

REGISTERS

REMOTE 1 AND 2 TEMP

HIGH LIMIT REGISTERS

REMOTE 1 AND 2 TEMP

LOW LIMIT REGISTERS

REMOTE 1 AND 2 TEMP

THERM LIMIT REGISTER

LOCAL TEMPERATURE

HIGH LIMIT REGISTER

LOCAL TEMPERATURE

LOW LIMIT REGISTER

LOCAL TEMPERATURE

THERM LIMIT REGISTER

ONE−SHOT

REGISTER

ADDRESS POINTER

REGISTER

CONVERSION RATE

REGISTER

REMOTE 1 AND 2 TEMP

VALUE REGISTERS

LOCAL TEMPERATURE

VALUE REGISTER

ON−CHIP TEMP

SENSOR

ANALOG

MUX

EXTERNAL DIODES OPEN−CIRCUIT

SMBUS INTERFACE

ADT7481

7

8

3

2

10

4

1

69

GND

SDATA

SCLK

THERM

8

D1+

D1–

D2+

D2–

ALERT/THERM2

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

−0.3 to +3.6

V

D+

V

D− to GND

−0.3 to +0.6

V

SCLK, SDATA, ALERT, THERM

−0.3 to +3.6

V

Input Current, SDATA, THERM

−1 to +50

mA

Input Current, D−

±1

mA

ESD Rating, All Pins (Human Body Model)

1500

V

150

°C

Storage Temperature Range

−65 to +150

°C

IR Reflow Peak Temperature

220

°C

IR Reflow Peak Temperature for Pb−Free

260

°C

Lead Temperature, Soldering (10 sec)

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

Unit

10−Lead MSOP

142

43.74

°C/W