LMV331, LMV393, LMV339

http://onsemi.com

19

PACKAGE DIMENSIONS

ULLGA8, 1.5x1.5, 0.5P

CASE 613AG−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

A

B

E

D

BOTTOM VIEW

b

e

8X

0.10

B

0.05

A

C

C

L

8X

NOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

8X

A

A1

0.05 C

0.05 C

PLANE

SIDE VIEW

L3

1

3

5

7

DIM MIN

MAX

MILLIMETERS

A

−−−

0.40

A1

0.00

0.05

b

0.20

0.30

D

1.50 BSC

E

1.50 BSC

e

0.50 BSC

L

0.25

0.35

DIMENSIONS: MILLIMETERS

0.51

7X

0.32

8X

1.65

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

0.50

1

MOUNTING FOOTPRINT*

PACKAGE

OUTLINE

b1

0.30

0.40

L1

0.05 REF

L3

0.15 REF

b1

L1

0.42