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DESCRIPTION/

1

2

3

4

5

6

7

14

13

12

11

10

9

8

1OUT

1IN −

1IN+

2IN+

2IN −

2OUT

4OUT

4IN −

4IN+

3IN+

3IN −

3OUT

LMV824 . . . D, DGV, OR PW PACKAGE

(TOP VIEW)

LMV822 . . . D OR DGK PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1OUT

1IN −

1IN +

2OUT

2IN −

2IN +

LMV821 . . . DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

5

4

IN +

IN −

OUT

LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS434I – FEBRUARY 2004 – REVISED JULY 2006

•

2.5-V, 2.7-V, and 5-V Performance

•

–40

°C to 125°C Operation

•

No Crossover Distortion

•

– LMV821

…0.3 mA Typ

– LMV822

…0.5 mA Typ

– LMV824

…1 mA Typ

•

Rail-to-Rail Output Swing

•

Gain Bandwidth of 5.5 MHz Typ at 5 V

•

Slew Rate of 1.9 V/

µs Typ at 5 V

ORDERING INFORMATION

The LMV821 single, LMV822 dual, and LMV824

quad devices are low-voltage (2.5 V to 5.5 V),

low-power

commodity

operational

amplifiers.

Electrical characteristics are very similar to the

LMV3xx operational amplifiers (low supply current,

rail-to-rail outputs, input common-mode range that

includes ground). However, the LMV8xx devices

offer a higher bandwidth (5.5 MHz typical) and faster

slew rate (1.9 V/

µs typical).

The LMV8xx devices are cost-effective solutions for

applications

requiring

low-voltage/low-power

operation and space-saving considerations. The

LMV821 is available in the ultra-small DCK package,

which is approximately half the size of SOT-23-5.

The DCK package saves space on printed circuit

boards and enables the design of small portable

electronic devices (cordless and cellular phones,

laptops, PDAs, PCMIA). It also allows the designer

to place the device closer to the signal source to

reduce noise pickup and increase signal integrity.

The LMV8xx devices are characterized for operation

from –40

°C to 85°C. The LMV8xxI devices are

characterized for operation from –40

°C to 125°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2004–2006, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.