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FEATURES

3

2

4

5

1

A

C

B

GND

DBV PACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOM VIEW)

DCK PACKAGE

(TOP VIEW)

3

2

4

5

1

A

C

B

GND

3

2

4

5

1

A

C

B

GND

A

GND

C

B

DRL PACKAGE

(TOP VIEW)

See mechanical drawings for dimensions.

1

4

2

3

5

DESCRIPTION/ORDERING INFORMATION

SN74LVC1G66

SINGLE BILATERAL ANALOG SWITCH

SCES323L – JUNE 2001 – REVISED JANUARY 2007

• Available in the Texas Instruments

• Low On-State Resistance, Typically ≈5.5 Ω

NanoFree™ Package

(V

• 1.65-V to 5.5-V V

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• Inputs Accept Voltages to 5.5 V

• ESD Protection Exceeds JESD 22

• Max t

–

2000-V Human-Body Model (A114-A)

• High On-Off Output Voltage Ratio

–

200-V Machine Model (A115-A)

• High Degree of Linearity

–

1000-V Charged-Device Model (C101)

• High Speed, Typically 0.5 ns

(V

The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of

up to 5.5 V (peak) to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for

analog-to-digital and digital-to-analog conversion systems.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

Reel of 3000

SN74LVC1G66YZPR

_ _ _C6_

(Pb-free)

Reel of 3000

SN74LVC1G66DBVR

SOT (SOT-23) – DBV

C66_

–40

°C to 85°C

Reel of 250

SN74LVC1G66DBVT

Reel of 3000

SN74LVC1G66DCKR

SOT (SC-70) – DCK

Reel of 250

SN74LVC1G66DCKT

C6_

SOT (SOT-553) – DRL

Reel of 4000

SN74LVC1G66DRLR

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2001–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.