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Seemechanicaldrawingsfordimensions.

NC – Nointernalconnection

DBVPACKAGE

(TOP VIEW)

2

5

3

4

Y

1

B

GND

A

V

CC

DCKPACKAGE

(TOP VIEW)

3

4

2

Y

1

GND

B

A

5

V

CC

DRL PACKAGE

(TOP VIEW)

2

B

1

A

3

4

GND

Y

5

V

CC

YZP PACKAGE

(BOTTOMVIEW)

2

B

1

A

GND

4

3

Y

5

V

CC

DRY PACKAGE

(TOP VIEW)

B

NC

A

6

5

4

2

3

GND

Y

V

CC

1

DESCRIPTION/ORDERING INFORMATION

•

A

B

in positive logic.

SN74LVC1G32

SINGLE 2-INPUT POSITIVE-OR GATE

SCES219O – APRIL 1999 – REVISED FEBRUARY 2007

• Available in the Texas Instruments

• I

NanoStar™ and NanoFree™ Packages

Operation

• Supports 5-V V

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• Inputs Accept Voltages to 5.5 V

• ESD Protection Exceeds JESD 22

• Max t

–

2000-V Human-Body Model (A114-A)

• Low Power Consumption, 10-µA Max I

CC

–

200-V Machine Model (A115-A)

• ± 24-mA Output Drive at 3.3 V

–

1000-V Charged-Device Model (C101)

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

preventing damaging current backflow through the device when it is powered down.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 1999–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.