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See mechanical drawings for dimensions.

DBV PACKAGE

(TOP VIEW)

2

6

5

3

4

Y

1

1

GND

E

A

Y

0

V

CC

DCK PACKAGE

(TOP VIEW)

3

4

E

2

GND

Y

1

1

A

6

5

Y

0

V

CC

DRL PACKAGE

(TOP VIEW)

2

GND

1

A

3

4

E

Y

1

6

5

Y

0

V

CC

YZP PACKAGE

(BOTTOM VIEW)

2

GND

1

A

E

4

3

Y

1

6

5

Y

0

V

CC

DRY PACKAGE

(TOP VIEW)

GND

V

CC

A

6

5

4

2

3

E

Y

1

Y

0

1

DESCRIPTION/ORDERING INFORMATION

SN74LVC1G19

1-OF-2 DECODER/DEMULTIPLEXER

SCES464E – JUNE 2003 – REVISED FEBRUARY 2007

• Available in the Texas Instruments

• V

NanoFree™ Package

• Supports 5-V V

• I

Operation

• Inputs Accept Voltages to 5.5 V

• Latch-Up Performance Exceeds 100 mA Per

• Max t

JESD 78, Class II

• Low Power Consumption, 10-µA Max I

CC

• ESD Protection Exceeds JESD 22

• ±24-mA Output Drive at 3.3 V

–

2000-V Human-Body Model (A114-A)

• V

–

200-V Machine Model (A115-A)

V

–

1000-V Charged-Device Model (C101)

The SN74LVC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it to

preventing damaging current backflow through the device when it is powered down.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.