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L9952GXP 데이터시트(PDF) 31 Page - STMicroelectronics |
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L9952GXP 데이터시트(HTML) 31 Page - STMicroelectronics |
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31 / 68 page ![]() L9952GXP Thermal data Doc ID 13518 Rev 5 31/68 6.3 Package and PCB thermal data Figure 9. PowerSSO-36 PC board Note: Layout condition of Rth and Zth measurements ( board finish thickness 1.6 mm +/- 10% board double layer, board dimension 129x60, board Material FR4, Cu thickness 0.070mm (front and back side), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm ). |
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