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TPD4S009DBVR 데이터시트(PDF) 2 Page - Texas Instruments |
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TPD4S009DBVR 데이터시트(HTML) 2 Page - Texas Instruments |
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2 / 18 page ![]() D1+ D1– GND V CC D2+ D2– D1+ D1– GND D2+ D2– TPD4S009 TPD4S010 SLVS817D – MAY 2008 – REVISED MARCH 2010 www.ti.com ORDERING INFORMATION ORDERABLE TOP-SIDE TA PACKAGE(1) (2) NOMINAL DIMENSIONS (mm) PART NUMBER MARKING(3) Reel of MSOP – DGS W = 4.9, L = 3, H < 1.1, Pitch = 0.5 TPD4S009DGSR 3HR 3000 Reel of SON – DQA W = 1, L = 2.5, H < 1.1, Pitch = 0.5 TPD4S010DQAR 4UR 3000 Reel of –40°C to 85°C SON – DRY W = 1, L = 1.45, H = 0.55, Pitch = 0.5 TPD4S009DRYR 3H 5000 Reel of SOT (SC-70) – DCK W = 2.1, L = 2, H = 0.95, Pitch = 0.65 TPD4S009DCKR 3H_ 3000 Reel of SOT (SOT-23) – DBV W = 2.9, L = 2.8, H < 1.45, Pitch = 0.95 TPD4S009DBVR NFJK 3000 (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) DCK: The actual top-side marking has one additional character that designates wafer fab/assembly site. CIRCUIT DIAGRAMS TPD4S009 TPD4S010 2 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 |
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