| 전자부품 데이터시트 검색엔진 |
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SC667 데이터시트(PDF) 23 Page - Semtech Corporation |
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SC667 데이터시트(HTML) 23 Page - Semtech Corporation |
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23 / 47 page ![]() SC667 23 Applications Information (continued) Thermal Management A junction temperature calculation should be performed for each new application design to ensure the device will not exceed 125°C during normal operation. The first step is to determine how much power can be dissipated by the SC667 in the application. The following formula approxi- mates the maximum dissipation. This formula can be used to sum the maximum internal power dissipation required of each LDO and each backlight sink. 7 1 m BLm BLm 4 1 n LDOn LDOn IN D I V I ) V V ( P The resulting power dissipation can then be used in the calculation for maximum junction temperature. D JA A J P T T where, T A = Maximum ambient temperature rating in °C. Q JA= Thermal resistance, from junction to ambient, equal to 35°C/W for a optimum circuit board layout. |
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