ADP320

Rev. 0 | Page 19 of 20

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by

increasing the amount of copper attached to the pins of the

ADP320 triple LDO. However, as can be seen from Table 6, a

point of diminishing returns eventually is reached, beyond

which an increase in the copper size does not yield significant

heat dissipation benefits.

Place the input capacitor as close as possible to the VINx and

GND pins. Place the output capacitors as close as possible to

the VOUTx and GND pins. Use 0402 or 0603 size capacitors

and resistors to achieve the smallest possible footprint solution

on boards where area is limited.

Figure 51. Example of PCB Layout, Top Side

Figure 52. Example of PCB Layout, Bottom Side