74LVC2G66

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 5 — 16 June 2010

2 of 26

NXP Semiconductors

74LVC2G66

Bilateral switch

3.

Ordering information

4.

Marking

[1]

The pin 1 indicator is located on the lower left corner of the device, below the marking code.

5.

Functional diagram

Table 1.

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74LVC2G66DP

−40 °C to +125 °C

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

SOT505-2

74LVC2G66DC

−40 °C to +125 °C

VSSOP8

plastic very thin shrink small outline package; 8 leads;

body width 2.3 mm

SOT765-1

74LVC2G66GT

−40 °C to +125 °C

XSON8

plastic extremely thin small outline package; no leads;

8 terminals; body 1

× 1.95 × 0.5 mm

SOT833-1

74LVC2G66GD

−40 °C to +125 °C

XSON8U plastic extremely thin small outline package; no leads;

8 terminals; UTLP based; body 3

× 2 × 0.5 mm

SOT996-2

74LVC2G66GM

−40 °C to +125 °C

XQFN8U

plastic extremely thin quad flat package; no leads;

8 terminals; UTLP based; body 1.6

× 1.6 × 0.5 mm

SOT902-1

Table 2.

Marking codes

Type number

Marking code[1]

74LVC2G66DP

V66

74LVC2G66DC

V66

74LVC2G66GT

V66

74LVC2G66GD

V66

74LVC2G66GM

V66

Fig 1.

Logic symbol

Fig 2.

IEC logic symbol

001aah807

001aah808

1

1

X1

1

1

X1

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