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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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B32504 데이터시트(PDF) 40 Page - EPCOS |
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B32504 데이터시트(HTML) 40 Page - EPCOS |
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40 / 46 page  3 Embedding of capacitors in finished assemblies In many applications, finished circuit assemblies are embedded in plastic resins. In this case, both chemical and thermal influences of the embedding ("potting") and curing processes must be taken into account. Our experience has shown that the following potting materials can be recommended: non-flexible epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum curing temperature of 100 °C. Caution: Consult us first if you wish to embed uncoated types! B32520 ... B32529 General purpose (stacked/wound) Page 40 of 46 Please read Important notes at the end of this document. |
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