AXA2R

PRODUCT TYPES

SPECIFICATIONS

1. Characteristics

Note: *1. The above characteristics cannot be guaranteed when a card other than the specified ones is used.

2. Material and surface treatment

Product

name

Eject type

Card detection

switch

Card jump-out

prevention

function

Mounting

type

Standoff

height

(mm)

Part No.

Packing quantity

Inner carton

Outer carton

Sockets for

SD memory

card

(R type)

Push-push

type

Available

Available

Standard

mounting

type

0

AXA2R73061

∗

Asterisk “

∗ ” mark on end of

Part No.;

P: 350 pieces (1 reel)

(Embossed tape package)

T: 35 pieces (1 tray)

(Tray package)

Asterisk “

∗ ” mark on end of

Part No.;

P: 700 pieces (2 reels)

(Embossed tape package)

T: 700 pieces (20 trays)

(Tray package)

1. 5

AXA2R73361

∗

Reverse

mounting

type

0

AXA2R63061

∗

1.5

AXA2R63361

∗

Not available

Standard

mounting

type

0

AXA2R73021

∗

1.5

AXA2R73321

∗

Reverse

mounting

type

0

AXA2R63021

∗

1.5

AXA2R63321

∗

Item

Specifications

Condition

Electrical

characteristics

Rated Current

0.5 A/1 terminal

Contact resistance

Signal contact portion: Max. 100m

Ω (Initial)

Detection contact portion: Max. 150m

Ω (Initial)

(Card detection and write protection detection)

Measured based on the HP4338B measurement

method of JIS C5402

Insulation resistance

Min. 1,000M

Ω (Initial)

Using 500V DC megger (applied for 1 min.)

Breakdown voltage

500V AC for 1 min.

Rated voltage is applied for one minute and check

for short circuit or damage with a detection current

of 1 mA.

Mechanical

characteristics

Vibration resistance

Frequency: 10 to 55 Hz

No current interruption for more than 0.1

µs

Card insertion force

Max. 40N

Card removal force

Min. 1N, Max. 40N

Lifetime

characteristics

Insertion and removal

life of card

Insertion and removal life: 10,000 times

Contact resistance after testing:

Signal contact portion: Max. 100m

Ω

Detection contact portion: Max. 150m

Ω

(Card detection and write protection detection)

Insertion and removal speed are at a rate of 600

times/hour or less.

Environmental

characteristics

Ambient temperature

–25

°C to +90°C

No freezing or condensation in low temperatures

Storage temperature

–40

°C to +90°C (The allowable storage temperature is –40°C to +50°C

if unopened from original packaging)

No freezing or condensation in low temperatures

Resistance to soldering

heat

Reflow soldering: peak temperature 250

°C or less

Hand soldering: Soldering iron temperature 300

°C, 5 sec. or less

Sockets (shell) surface temperature for using

infrared reflow soldering machine

Humidity tolerance

(mated condition)

Contact resistance:

Signal contact portion: Max. 100m

Ω

Detection contact portion: Max. 150m

Ω

(Card detection and write protection detection)

Insulation resistance: Min. 100 M

Ω

MIL-STD-1344A, METHOD 1002

Temperature: 40

±2°C, Humidity: 90 to 95%RH,

Test time: 500 hours

Applicable memory card

Unit weight

2.9g

Portion

Material

Surface

Signal contact

Copper alloy

Contact portion: Ni plating on base, PdNi plating + Au flash plating

Soldering portion: Ni plating on base, Au plating on surface

Detection contact

Contact/Soldering portion: Ni plating on base, Au plating on surface

Retention solder tab

Stainless steel

Soldering portion: Ni strike, Partial Au plating

panasonic-electric-works.net/ac

To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009