SP510

35

REV. 1.0.0

ULTRA HIGH SPEED MULTIPROTOCOL TRANSCEIVER

Thermal Considerations

High speed devices like the SP510 dissipate heat during normal operation. Actual power dissipation is a

function of the switching frequency and loading. For maximum system performance and reliability designers

should ensure sufficient air flow. Other commonly used methods for managing heat include heat sinks for

higher powered devices, forced air flow (fans) and lower density board stuffing.

PCB Design

The use of multi layer printed circuit boards is recommended to provide both a better ground plane and a

thermal path for heat dissipation. If possible, the ground plane should face the bottom of the package to form

the thermal conduction plane. Two-sided printed circuit boards may be used where board dimensions and

package count are small, but multi-layer boards allow for improved signal routing as well as improved signal

integrity. A multi layer board allows the use of microstrip line techniques to provide for high speed signal

interconnections. On multi-layer boards route the high speed signal lines on the inner layers.