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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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430 데이터시트(PDF) 92 Page - Intel Corporation |
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430 데이터시트(HTML) 92 Page - Intel Corporation |
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92 / 100 page  Boxed Processor Specifications 92 Datasheet 7.1 Mechanical Specifications 7.1.1 Boxed Processor Cooling Solution Dimensions This section documents the mechanical specifications of the boxed processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 23 shows a mechanical representation of the boxed processor. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 24 (Side View), and Figure 25 (Top View). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 29 and Figure 30. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning. Figure 24. Space Requirements for the Boxed Processor (Side View) Boxed_Proc_SideView 95.0 [3.74] 10.0 [0.39] 25.0 [0.98] 81.3 [3.2] |
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