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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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335 데이터시트(PDF) 74 Page - Intel Corporation |
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335 데이터시트(HTML) 74 Page - Intel Corporation |
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74 / 82 page  74 Datasheet Boxed Processor Specifications 7.1 Mechanical Specifications 7.1.1 Boxed Processor Cooling Solution Dimensions This section documents the mechanical specifications of the boxed Celeron D processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a mechanical representation of the boxed Celeron D processor. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 7-2 (Side Views), and Figure 7-3 (Top View). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 7-6 and Figure 7-7. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning. Figure 7-2. Requirements for the Boxed Processor (Side View) Figure 7-3. Space Requirements for the Boxed Processor (Top View) |
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