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M95160-R 데이터시트(PDF) 43 Page - STMicroelectronics |
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M95160-R 데이터시트(HTML) 43 Page - STMicroelectronics |
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43 / 50 page ![]() M95160-x, M95080-x Package mechanical data Doc ID 8028 Rev 10 43/50 Figure 20. WLCSP-R 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package outline 1. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 2. Drawing is not to scale. 3. Preliminary data. Table 30. WLCSP-R 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package mechanical data(1) 1. Preliminary data. Symbol millimeters inches(2) 2. Values in inches are converted from mm and rounded to 4 decimal digits. Typ Min Max Typ Min Max A 0.545 0.490 0.600 0.0193 0.0215 0.0236 A1 0.190 0.0075 A2 0.355 0.014 b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.270 0.240 0.300 0.0106 0.0094 0.0118 D 1.350 1.475 0.0531 0.0581 E 1.365 1.490 0.0537 0.0587 e 0.400 0.0157 e1 0.800 0.0315 F 0.282 0.0111 G 0.275 0.0108 N (total number of terminals) 88 aaa 0.110 0.0043 eee 0.060 0.0024 1C_ME Wafer back side Side view Bump side Detail A Rotated 90˚ Seating plane (see note 1) b Orientation reference D E Orientation reference Detail A e1 e G e F e1 32 1 C B A A2 A Bump eee Z A1 Z aaa (×4) |
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