M95512-WCS3GSLASHK datasheet(41/48 Pages) STMICROELECTRONICS

41 / 48 page

M95512-W, M95512-R

Package mechanical data

Doc ID 11124 Rev 13

41/48

Figure 25.

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3 mm, package outline

Drawing is not to scale.

The central pad (the area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 21.

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3 .mm, package mechanical data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

0.55

0.50

0.60

0.0217

0.0197

0.0236

0.02

0.00

0.05

0.0008

0.0020

0.25

0.20

0.30

0.0098

0.0079

0.0118

2.00

1.90

2.10

0.0787

0.0748

0.0827

1.60

1.50

1.70

0.0630

0.0591

0.0669

ddd

0.08

0.0031

3.00

2.90

3.10

0.1181

0.1142

0.1220

0.20

0.10

0.30

0.0079

0.0039

0.0118

e0.50–

–

0.0197

–

0.45

0.40

0.50

0.0177

0.0157

0.0197

0.15

0.0059

0.30

0.0118

UFDFPN-01

ddd

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