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M24M01-HRMN6TP/A 데이터시트(PDF) 29 Page - STMicroelectronics

부품명 M24M01-HRMN6TP/A
상세설명  1 Mbit serial I²C bus EEPROM
PDF  37 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24M01-HRMN6TP/A 데이터시트(HTML) 29 Page - STMicroelectronics

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M24M01-R, M24M01-W, M24M01-HR
Package mechanical data
Doc ID 12943 Rev 7
29/37
Figure 16.
WLCSP8 – Wafer level chip scale package outline
1.
Drawing is not to scale and corresponds to preliminary data.
2.
The dimension is measured at the maximum bump diameter parallel to primary datum Z.
3.
The primary datum Z and seating plane are defined by the spherical crowns of the bump.
4.
Bump position designation per JESD 95-1, SPP-010.
Table 17.
WLCSP8 – Wafer level chip scale package mechanical data(1)
1.
Preliminary data.
Symbol
millimeters
inches(2)
2.
Values in inches are converted from mm and rounded to 4 decimal digits.
Typ
Min
Max
Typ
Min
Max
A
0.580
0.555
0.605
0.0228
0.0219
0.0238
A1
0.230
0.0091
A2
0.350
0.0138
b
0.322
0.0127
D
3.570
3.685
0.1406
0.1451
E
2.050
2.165
0.0807
0.0852
e
0.600
0.0236
e1
2.400
0.0945
e2
1.200
0.0472
F
0.585
0.0230
G
0.424
0.0167
aaa
0.110
0.0043
bbb
0.110
0.0043
ccc
0.110
0.0043
ddd
0.060
0.0024
eee
0.060
0.0024
N (number of bumps) 8
Orientation reference
Wafer’s back side
Side view
Bump side
Orientation
reference
Detail A
Bump
Seating plane(3)
Detail A rotated by 90°
D
E
A2
A
F
e1
e2
e
e2
G
A1
b(8X)(2)
Note 4
(4X)
eee Z
Z
aaa
E1_ME



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