STCD1020PDH6F datasheet(15/40 Pages) STMICROELECTRONICS

15 / 40 page

STCD1020, STCD1030, STCD1040

Maximum ratings

Doc ID 13823 Rev 6

15/40

Maximum ratings

Stressing the device above the rating listed in the absolute maximum ratings table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Table 4.

Absolute maximum ratings (1.8 V supply)

Symbol

Parameter

Value

Unit

TSTG

Storage temperature (VCC off)

–55 to 150

°C

TSLD

(1)

Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.

Lead solder temperature for 10 seconds

260

°C

Maximum junction temperature

150

°C

VCC

Supply voltage

–0.3 to 3.6

VIN

Input voltage level

–0.3 to 3.6

VEN

Voltage on enable pins

–0.3 to 3.6

Thermal resistance (junction to ambient)

TDFN8

149.0

°C/W

TDFN10

136.6

°C/W

TDFN12

132.4

°C/W

Table 5.

Absolute maximum ratings (2.8 V supply)

Symbol

Parameter

Value

Unit

TSTG

Storage temperature (VCC off)

–55 to 150

°C

TSLD

(1)

Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.

Lead solder temperature for 10 seconds

260

°C

Maximum junction temperature

150

°C

VCC

Supply voltage

–0.3 to 6

VIN

Input voltage level

–0.3 to 6

VEN

Voltage on enable pins

–0.3 to 6

Thermal resistance (junction to ambient)

TDFN8

149.0

°C/W

TDFN10

136.6

°C/W

TDFN12

132.4

°C/W

STCD1020PDH6F 데이터시트(PDF) 15 Page - STMicroelectronics

STCD1020PDH6F 데이터시트(HTML) 15 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

데이터시트 다운로드

링크 URL