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PCK946 데이터시트(PDF) 13 Page - NXP Semiconductors |
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PCK946 데이터시트(HTML) 13 Page - NXP Semiconductors |
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13 / 13 page ![]() © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 13 December 2005 Document number: 9397 750 12296 Published in The Netherlands Philips Semiconductors PCK946 Low voltage 1 : 10 CMOS clock driver 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 9 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 10 Application information. . . . . . . . . . . . . . . . . . . 6 10.1 Driving transmission lines . . . . . . . . . . . . . . . . . 6 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12.1 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 9 12.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 9 12.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 10 12.5 Package related soldering information . . . . . . 10 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 19 Contact information . . . . . . . . . . . . . . . . . . . . 12 |
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