AD8376ACPZ-R7 datasheet(23/24 Pages) AD

23 / 24 page

AD8376

Rev. A | Page 23 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10 SQ

2.95

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 52. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8376ACPZ-WP

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] , Waffle Pack

CP-32-2

AD8376ACPZ-R7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7”Tape and Reel

CP-32-2

AD8376-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

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