2N2894ADCSM

Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed

to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.

Semelab encourages customers to verify that datasheets are current before placing orders.

Document Number 6621

Issue 1

DUAL HIGH SPEED, MEDIUM POWER

PNP GENERAL PURPOSE TRANSISTOR

IN A HERMETICALLY SEALED

CERAMIC SURFACE MOUNT PACKAGE

FEATURES

• SILICON PLANAR EPITAXIAL DUAL PNP

TRANSISTOR

• HERMETIC CERAMIC SURFACE MOUNT

PACKAGE

• CECC SCREENING OPTIONS AVAILABLE

• SPACE QUALITY LEVELS OPTIONS

• HIGH SPEED SATURATED SWITCHING

APPLICATIONS:

For high reliablitity general purpose

applications requiring small size and low

weight devices.

Collector Current

Device Dissipation

Derate above 50°C

Thermal Resistance Junction to Ambient

Max Junction Temperature

Storage Temperature

–12V

–12V

–4.5V

–200mA

300mW

2mW / °C

420°C / W

500mW

3.3mW / °C

250°C / W

MECHANICAL DATA

Dimensions in mm (inches)

LCC2 PACKAGE

Underside View

A

2

1

3

4

5

6

6.22 ± 0.13

(0.245 ± 0.005)

1.65 ± 0.13

(0.065 ± 0.005)

2.29 ± 0.20

(0.09 ± 0.008)

1.27 ± 0.13

(0.05 ± 0.005)

1.40 ± 0.15

(0.055 ± 0.006)

0.23

(0.009)

rad.

A =

PAD 1 - Collector 1

PAD 2 - Base 1

PAD 3 - Base 2

PAD 4 - Collector 2

PAD 5 - Emitter 2

PAD 6 - Emitter 1

200°C

–65 to 200°C

PER SIDE

TOTAL