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AP1601 데이터시트(PDF) 5 Page - Diodes Incorporated

부품명 AP1601
상세설명  STEP-UP DC/DC CONVERTER
PDF  12 Pages
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제조업체  DIODES [Diodes Incorporated]
홈페이지  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AP1601 데이터시트(HTML) 5 Page - Diodes Incorporated

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AP1601
STEP-UP DC/DC CONVERTER
AP1601 Rev. 5
5 of 12
SEPTEMBER 2009
www.diodes.com
© Diodes Incorporated
Electrical Characteristics
(VBATT = 2V, FB = OUT (VOUT = 3.3V), RL = ∞, TA = 0°C to +85°C, unless otherwise noted. Typical values are at
TA = +25°C.)
Symbol
Parameter
Conditions
Min
Typ.
Max
Unit
Minimum Input Voltage
-
0.9
-
V
VIN
Operating Voltage
TA = +25°C
1.1
-
5.5
V
Start-Up Voltage
TA = +25°C,
RL = 3k
Ω (Note 3)
-
0.9
1.1
V
Start-Up Voltage
Temperature
-
-2
-
mV/°C
Output Voltage Range
2
-
5.5
V
IOUT
Steady-State Output
Current (Note 4)
(VOUT = 3.3V)
AP1601
(CLSEL=OUT)
300
420
-
mA
AP1601
(CLSEL=GND)
150
220
-
(VOUT = 5V)
AP1601
(CLSEL=OUT)
180
285
-
AP1601
(CLSEL=GND)
90
130
-
VREF
Reference Voltage
IREF=0
1.176
1.2
1.224
V
TEMPCO
Reference Voltage
Temperature
-
0.024
-
mV/°C
VREF_LOAD
Reference Voltage Load
Regulation
IREF=0 to 20μA
-
30
80
mV
VREF_LINE
Reference Voltage Line
Regulation
VOUT=2V to 5.5V
-
0.08
2.5
mV/V
FB, LB1 Input Threshold
1.176
1.2
1.224
V
RDS(ON)
Internal NFET, PFET
On-Resistance
ILX=100mA
-
0.3
0.6
Ω
ILIM
LX Switch Current Limit
(NFET)
AP1601 MSOP-8L
0.80
1
1.20
A
AP1601 MSOP-10L (CLSEL=OUT)
0.80
1
1.20
AP1601 MSOP-10L (CLSEL=GND)
0.40
0.50
0.65
ILEAK
LX Leakage Current
ILX=0, 5.5V; VOUT=5.5V
-
0.05
1
μA
θ
JA
Thermal Resistance
Junction-to-Ambient
MSOP-8L (Note 5)
118
oC/W
MSOP-10L (Note 5)
88
θ
JC
Thermal Resistance
Junction-to-Case
MSOP-8L (Note 5)
30
oC/W
MSOP-10L (Note 5)
16
Notes:
3. Start-up voltage operation is guaranteed with the addition of a Schottky B0520LW external diode between the input and output.
4. Steady-state output current indicates that the device maintains output voltage regulation under load.
5. Test condition for MSOP-8L and MSOP-10L: Devices mounted on 2oz copper, with minimum recommended pad layout on top and bottom
layer with thermal vias, double side FR-4 PCB.



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