LM3464AMH datasheet(4/22 Pages) NSC

4 / 22 page

Name

Description

Application Information

SE4

Channel 4 sense input

Connect to an external sense resistor to define the Channel 4

LED current.

GD4

Channel 4 gate driver output

Connect to the gate of external NMOS to control the channel

4 LED current.

PGND

Power Ground

Ground for power circuitry. Reference point for all stated

voltages. Must be externally connected to EP and AGND

GD3

Channel 3 gate driver output

Connect to the gate of external NMOS to control the channel

3 LED current.

SE3

Channel 3 sense input

Connect to an external sense resistor to define the Channel 3

LED current.

GD2

Channel 2 gate driver output

Connect to the gate of external NMOS to control the channel

2 LED current.

SE2

Channel 2 sense input

Connect to an external sense resistor to define the Channel 2

LED current.

GD1

Channel 1 gate driver output

Connect to the gate of external NMOS to control the channel

1 LED current.

SE1

Channel 1 sense input

Connect to an external sense resistor to define the Channel 1

LED current.

Thermal Pad (Power Ground)

Used to dissipate heat from the package during operation.

Must be electrically connected to PGND external to the

package.

LM3464AMH 데이터시트(PDF) 4 Page - National Semiconductor (TI)

LM3464AMH 데이터시트(HTML) 4 Page - National Semiconductor (TI)

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

데이터시트 다운로드

링크 URL