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MMBT2222AT 데이터시트(PDF) 1 Page - Diodes Incorporated |
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MMBT2222AT 데이터시트(HTML) 1 Page - Diodes Incorporated |
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1 / 4 page ![]() MMBT2222AT NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR Features DS30268 Rev. 10 - 2 1 of 4 www.diodes.com MMBT2222AT © Diodes Incorporated • Epitaxial Planar Die Construction • Complementary PNP Type Available (MMBT2907AT) • Ultra-Small Surface Mount Package • Lead Free/RoHS Compliant (Note 2) • "Green" Device (Note 3 and 4) Mechanical Data • Case: SOT-523 • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020C • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). • Terminal Connections: See Diagram • Marking Information: 1P, See Page 4 • Ordering & Date Code Information: See Page 4 • Weight: 0.002 grams (approximate) SOT-523 Dim Min Max Typ A 0.15 0.30 0.22 B 0.75 0.85 0.80 C 1.45 1.75 1.60 D ⎯ ⎯ 0.50 G 0.90 1.10 1.00 H 1.50 1.70 1.60 J 0.00 0.10 0.05 K 0.60 0.80 0.75 L 0.10 0.30 0.22 M 0.10 0.20 0.12 N 0.45 0.65 0.50 α 0 ° 8 ° ⎯ All Dimensi mm ons in A M J L D Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Collector-Base Voltage VCBO 75 V Collector-Emitter Voltage VCEO 40 V Emitter-Base Voltage VEBO 6.0 V Collector Current - Continuous IC 600 mA Power Dissipation (Note 1) Pd 150 mW Thermal Resistance, Junction to Ambient (Note 1) RθJA 833 °C/W Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. No purposefully added lead 3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. E B C B C H K G TOP VIEW C E B N |
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