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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MMBD2004S 데이터시트(PDF) 1 Page - Diodes Incorporated |
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MMBD2004S 데이터시트(HTML) 1 Page - Diodes Incorporated |
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1 / 3 page  MMBD2004S HIGH VOLTAGE SURFACE MOUNT SWITCHING DIODE Features • Fast Switching Speed • Surface Mount Package Ideally Suited for Automated Insertion • High Reverse Breakdown Voltage • Dual Series Configuration • Lead, Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 3 and 4) • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data • Case: SOT-23 • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). • Polarity: See Diagram • Ordering Information: See Page 2 • Marking Information: See Page 2 • Weight: 0.008 grams (approximate) SOT-23 Internal Schematic TOP VIEW TOP VIEW Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Repetitive Peak Reverse Voltage VRRM 300 V Working Peak Reverse Voltage DC Blocking Voltage VRWM VR 240 V RMS Reverse Voltage VR(RMS) 170 V Forward Continuous Current (Note 2) IFM 225 mA Peak Repetitive Forward Current (Note 2) IFRM 625 mA Non-Repetitive Peak Forward Surge Current @ t = 1.0 μs @ t = 1.0s IFSM 4.0 1.0 A Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 2) PD 350 mW Thermal Resistance Junction to Ambient Air (Note 2) RθJA 357 °C/W Operating and Storage Temperature Range TJ , TSTG -65 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Max Unit Test Condition Reverse Breakdown Voltage (Note 1) V(BR)R 300 ⎯ V IR = 100μA Forward Voltage VF ⎯ 0.87 1.0 V IF = 20mA IF = 100mA Reverse Current (Note 1) IR ⎯ 100 nA μA VR = 240V VR = 240V, TJ = 150°C Total Capacitance CT ⎯ 5.0 pF VR = 0, f = 1.0MHz Reverse Recovery Time trr ⎯ 50 ns IF = IR = 30mA, Irr = 3.0mA, RL = 100Ω Notes: 1. Short duration pulse test used to minimize self-heating effect. 2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 3. No purposefully added lead. Halogen and Antimony Free. 4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. MMBD2004S Document number: DS30281 Rev. 11 - 2 1 of 3 www.diodes.com June 2008 © Diodes Incorporated Please click here to visit our online spice models database. |
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